Odyssey Semiconductor Technologies Inc will expand the manufacturing capabilities of their facility by purchasing and installing cleanroom equipment. This facility upgrade will consist of semiconductor processing tools (autoprober, a coat-track machine, lift-off machine, sputter tool, asher, evaporator, and a robotic arm addition to automate the current RTP (Rapid Thermal Processing)) that will scale up their existing manufacturing capability from the current estimated production of 50 wafers per month to an estimated 500 wafers per month. The adaptation of this new equipment to their fabrication facility will allow higher efficiency power conversion for applications in personal electronics, electric vehicles, solar inverters, industrial motors, and smart power grid distribution.